Via-in-pad is one of the most debated techniques in modern PCB design.
Used correctly, it enables compact layouts, improved signal integrity,
and routing feasibility for fine-pitch components.
Used unnecessarily, it becomes a hidden source of cost, yield loss, and production risk.
At Comtec Labs, via-in-pad is rarely a neutral choice.
It is either clearly justified by electrical or mechanical requirements—or it creates avoidable complexity.
This article examines via-in-pad from a manufacturing-first perspective:
what it really means in production, where it adds value, and where it quietly hurts scalability.
What Via-in-Pad Really Means in Manufacturing
Via-in-pad places a via directly in a component pad.
To function reliably, that via must be:
• Filled
• Planarized
• Often capped or plated over
Each of these steps adds process complexity.
Each introduces variability.
Each increases cost.
In low-volume prototypes, this complexity is often invisible.
In volume production, it becomes measurable—in yield, rework, and inspection time.
When Via-in-Pad Is Technically Justified?
Via-in-pad is often the right choice when:
• BGA pitch is extremely small
• Escape routing is impossible with dogbone fanout
• High-speed signals require the shortest possible transitions
• Power integrity demands minimal inductance
In these cases, via-in-pad is not a luxury—it is a requirement.
The key is recognizing when you are solving a real problem,
and when you are simply making routing easier.
Hidden Manufacturing Risks
Common via-in-pad related issues include:
• Incomplete via fill
• Voids beneath pads
• Solder wicking into vias
• Uneven solder joints
• Increased AOI false calls
These issues rarely appear uniformly.
They appear statistically—eroding yield over time.
This makes via-in-pad particularly dangerous in scale-up phases,
where small yield losses translate directly into cost.
Cost and Scalability Impact
Alternatives That Often Scale Better
but they are often more robust, repeatable, and economical in production.
Vaihtoehdot ja DFM-ajattelu
Usein on olemassa yksinkertaisempia ja kestävämpiä ratkaisuja.
DFM:n ydin on kysyä:
tarvitaanko tätä oikeasti?
Jos ei, yksinkertaisempi ratkaisu on lähes aina parempi.
Ready to Reduce PCB Surprises?
If you’re navigating complex requirements, tight schedules, or production risk, Comtec Labs offers a full suite of services to streamline your workflow:
PCB design service
PCB prototyping service
PCB component sourcing
PCB component assembly
PCB testing service
PCB repair and modifications
Printed circuit board production
PCB mass production